... Un - patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect ...
... Ltd (Huasun) is a forefront technological innovation enterprise specializing in the R&D and large - scale manufacturing of ultra - high efficiency n - type silicon heterojunction (HJT) solar wafers, ...
Non - contact laser processing separates wafers effectively, preventing flaking at the cut edge. With Fonon's automated single - step processing, the quality of the edges - one of the critical ...
The JP will primarily produce 200mm silicon carbide wafers, which are 1.7x larger than 150mm wafers, translating to more efficient wafers and ultimately, lower costs. The JP underpins Wolfspeed's ...
PLACENTIA, Calif.-(BUSINESS WIRE)-Cleanroom Film and Bags (CFB), a division of C - P Flexible Packaging, has expanded its line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics and other sensitive electronic components. Having pioneered some of the first low ...
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