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...(Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied ... wafers and chips are temporarily bonded to a glass carrier with a temporary bonding material to ...
01Net
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19-9-2024
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About UL Solutions A global leader in applied safety science, UL Solutions (NYSE: ULS) transforms ... R&D center, equipment designer and manufacturer of advanced laser material processing... Continua a ...
01Net
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31-8-2024
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About UL Solutions A global leader in applied safety science, UL Solutions (NYSE: ULS) transforms ... R&D center, equipment designer and manufacturer of advanced laser material processing... Continua a ...
01Net
-
31-8-2024
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